Intuthuko yesikhathi esizayo kanye nezitayela zemboni yokucubungula i-laser yeshidi lensimbi
Kusukela ekuzalweni kwayo, ubuchwepheshe be-laser yensimbi yeshidi iye yangena ngokushesha futhi yaguqula ngokushesha imikhakha ehlukahlukene yokukhiqiza yesimanje ngamandla ayo aphezulu, ukunemba okuphezulu kanye nezici zokungathinti. Kusukela ekusikeni ngokunemba kwezingxenye ze-elekthronikhi kanye nokushisela imizimba yezimoto kuya ekukhiqizweni okungeziwe kwezingxenye zezindiza, ukucubungula nge-laser sekuwubuchwepheshe obuyinhloko bokuthuthukisa ukusebenza kahle kokukhiqiza, ukwenza ngcono ikhwalithi yomkhiqizo kanye nokwenza ukukhiqizwa okuyinkimbinkimbi.
Njengoba sibhekene nokukhuthazwa kokuthuthukiswa kwezimboni emhlabeni jikelele, inguquko entsha yamandla kanye ne-Industry 4.0, imboni yokucubungula i-laser imi endaweni ebalulekile yokuguquka komlando. Sizochaza ukuthi la "mandla okukhanya" aqhubeka kanjani nokubumba kabusha ikusasa lokukhiqiza ngokuthuthuka kobuchwepheshe, izinhlelo zokusebenza kanye nesimo semakethe.
→ Izitayela zobuchwepheshe obuyinhloko: ukunemba okuphezulu, amandla aphezulu kanye nobuhlakani
Ubuchwepheshe bokucubungula i-laser besikhathi esizayo buzojikeleza ezindleleni ezintathu eziyinhloko: ukunemba okuphelele, ukusebenza kahle kwamandla okuphezulu kanye nobuhlakani bokwenziwa obuhlanganiswe ngokujulile
Ubuchwepheshe be-laser: kusukela ku-fiber optics kuya ku-ultraviolet esheshayo nejulile
(1) Ukwenziwa kwaziwe kwama-laser asheshayo kanye nokucutshungulwa kwe-micro-nano:
Ikusasa le-laser ye-femtosecond/picosecond lizoba umkhuba wamandla aphezulu ajwayelekile, ukuzinza okuphezulu kanye nezindleko eziphansi. I-laser esheshayo igwema kakhulu ukuqhekeka okuncane, izendlalelo ezilungisiwe kanye nezindawo ezithinteke ngokushisa (i-HAZ) okubangelwa ukucubungula ukushisa kwendabuko ngokusebenzisa indlela "yokusebenza ebandayo" (umphumela ongewona owokushisa).
Amathuba okufaka isicelo: Izoba ubuchwepheshe obujwayelekile bokusika amaphaneli e-OLED/Mini/MicroLED, ukucubungula ingxenye ye-front-end engu-5G/6G RF (njenge-LTCC, i-PCB), ukukhiqizwa kwedivayisi yezokwelapha (njenge-stent, i-catheter) kanye nokusika kwe-wafer ye-semiconductor ephezulu. Umkhuba wesikhathi esizayo ukufeza umkhiqizo wamandla aphezulu wezinga lezimboni ongu-100W noma ngisho no-200W ngenkathi kuqinisekiswa ukuthi ububanzi be-pulse bungaphansi kwama-10ps.
(2) Ukuphumelela kuma-laser e-ultraviolet ejulile (DUV) kanye ne-extreme ultraviolet (EUV):
Njengoba ama-node enqubo yokukhiqiza ama-semiconductor eqhubeka nokuncipha, ubude be-wavelength yama-laser endabuko ayisakwazi ukuhlangabezana nesidingo. Esikhathini esizayo, ubuchwepheshe be-ultraviolet ejulile (njenge-266nm, 193nm) kanye nobuchwepheshe obuthuthukisiwe be-ultraviolet eyingozi (13.5nm) buzosetshenziswa kabanzi kwi-lithography ecolekile, ukubhoboza kanye nokuguqulwa kwendawo. Lokhu kuzohlobana ngqo nokufezwa kwezinqubo zokukhiqiza ama-chip angu-3nm kanye no-2nm.
(3) Ukusebenzisana kwe-fiber optical enamandla amakhulu kanye ne-disc laser:
Ezisetshenzisweni zamandla aphezulu njengokusika amapuleti amakhulu kanye nokushisela okunzima kwezimboni, ama-fiber lasers angu-10,000-watt (ngaphezu kuka-10kW) azohlala esetshenziswa kakhulu. Ukugxila esikhathini esizayo kuzoba ekuthuthukiseni ikhwalithi ye-beam kanye nobuchwepheshe bokubumba amabala, njengokusebenzisa imodi ye-beam elungisekayo (ABM) noma ubuchwepheshe be-composite spot, ukuze kuvumelane nezidingo zokucubungula zezinto ezahlukene kanye nobukhulu nokufeza ijubane eliphezulu lekhwalithi yokushisela.
Ubuhlakani kanye nokuzenzakalela: uhlelo lokucubungula oluhlanganisa i-AI
(1) Umbono womshini kanye nokunika amandla i-AI:
Imishini ye-laser yesikhathi esizayo ngeke isaba "umphathi" ozimele, kodwa uhlelo oluhlakaniphile olunokuqonda, ukwahlulela kanye namakhono okuzivumelanisa nezimo.
Ubuchwepheshe obuyinhloko: Yethula uhlelo lokubona lomshini olunencazelo ephezulu ukuze kuqashwe isimo sechibi elincibilikisiwe, indawo ethintekile ekushiseni kanye nomkhawulo osezingeni eliphezulu ngesikhathi sangempela. Ngokusebenzisa imodeli yokuqeqesha ye-algorithm yokufunda okujulile (i-DeepLearning), impendulo yesikhathi sangempela ye-closed-loop kanye nokulungiswa okuguquguqukayo kwamapharamitha okucubungula (amandla, isivinini, indawo yokugxila, ingcindezi yegesi evikelayo) kuyabonakala, njengokuhlonza nokususa ngokuzenzakalelayo ama-pores ngesikhathi senqubo yokushisela.
Umphumela: Ukuze kufezwe ukucutshungulwa "kokuchofoza kanye", umqhubi udinga kuphela ukusetha umphumela wezinto ezibonakalayo kanye nomgomo, futhi uhlelo luthuthukisa ngokuzenzakalelayo wonke amapharamitha, okunciphisa kakhulu ukuncika kochwepheshe abaphezulu.
(2) Ukuhlanganiswa okujulile kokukhiqiza okungeziwe (ukuphrinta kwe-3D):
Ukukhiqizwa kwezengezo ze-laser (njengokuncibilikisa i-SLM ekhethiwe, i-LMD ye-laser cladding) kuzodlula imikhawulo "yeqembu elincane, izindleko eziphakeme" futhi kuqhubekele ekukhiqizeni okukhulu nokuqhubekayo.
Umkhuba:Sebenzisa ukubambisana kwemisebe eminingi ye-laser kanye nobuchwepheshe bokuphrinta obukhulu ukuze uthuthukise ukusebenza kahle kokukhiqiza; izinhlobo zezinto zokwakha ziye zanda kusukela kuma-alloy ensimbi kuya kuma-ceramics asebenza kahle kakhulu kanye nezinto ezihlanganisiwe, ikakhulukazi ezingxenyeni zenjini yezindiza kanye Ukukhiqiza Isikhunta, okuzoholela ekukhuleni kwezinhlelo zokusebenza.
→ Izimakethe ezibalulekile zesicelo: amandla amasha, ama-semiconductor kanye ne-electronics eguquguqukayo
Amaphuzu okukhula ubuchwepheshe bokucubungula nge-laser kuzogxilwa kakhulu ezimbonini eziningana ezisafufusa ezidinga ukunemba okuphezulu kakhulu kanye nokusebenza kahle.
Izimoto ezintsha zamandla namabhethri kagesi: "ithrekhi yegolide" yokucubungula nge-laser
Ukuthandwa kwezimoto ezintsha zamandla kuzoba yinjini enkulu yokukhula embonini yokucubungula i-laser eminyakeni eyishumi ezayo.
(1) Isidingo esiphezulu sokukhiqizwa kwamabhethri kagesi
- Ukushisela i-core yebhethri: Ukushisela amathebhu ebhethri, ama-adapter, amamojula kanye nama-Packs kudinga ukuvalwa okuphezulu kakhulu, ukuhanjiswa kwamandla kanye nokukhanya okulula. Umkhuba wesikhathi esizayo ukushisela kwe-galvanometer okuskena okusheshayo kanye nokushisela kwe-laser okuhlanganisiwe (njenge-laser yokukhanya okuluhlaza okwesibhakabhaka). Izinga lokumuncwa kwe-laser eluhlaza okwesibhakabhaka ezintweni ezikhanyayo kakhulu njengethusi negolide liphakeme kakhulu kunele-laser ye-infrared. Ingaxazulula ngempumelelo izinkinga zokuchitheka kanye nokungazinzi kokungena futhi iyisisombululo esifanele sokushisela izinto zethusi.
- Ukusikwa kwepuleti: Ukusetshenziswa kwe-picosecond/femtosecond ultra-fast ukusika nge-laser Amapuleti ebhethri le-lithium (njenge-aluminium foil, i-copper foil) angafinyelela ukusika okuphelele ngama-burrs angenalutho kanye nomthelela wokushisa ongelutho, agweme ngempumelelo ingozi yama-short circuits angaphakathi ebhethri, futhi athuthukise ngqo ukuphepha nokuphila komjikelezo webhethri.
(2) Izingxenye zomzimba ezilula kanye nezakhiwo
Ekukhiqizweni kwezimoto, isilinganiso sokusetshenziswa kwe-aluminium alloys, insimbi enamandla amakhulu, kanye nezinto ezihlanganisiwe ze-carbon fiber (CFRP) siyaqhubeka nokukhula. Ukushisela nokusika nge-laser kuyindlela engcono kakhulu yokubhekana nalezi zinto ezingafani nezinamandla aphezulu, okusiza ekufezeni ukwenziwa ngcono kwesakhiwo kanye nokunciphisa isisindo somzimba wemoto.
Ama-semiconductor kanye nama-microelectronics: itshe lesisekelo lokukhiqiza okunembe kakhulu, okuncane
Ukucubungula nge-laser kuyithuluzi elibalulekile lokupakisha i-semiconductor back-end kanye nokukhiqizwa kwezingxenye ze-elekthronikhi zezinga eliphezulu.
(1) Ukusika nokusika i-wafer
Njengoba ukuhlanganiswa kwama-chip kukhuphuka futhi ubukhulu be-wafer buqhubeka nokwehla, ukusika amasondo okusika kwendabuko akusakwazi ukuhlangabezana nezidingo. Ubuchwepheshe be-Stealth Dicing busebenzisa i-laser ukwakha ungqimba oluguquliwe ngaphakathi kwe-wafer, bese buyihlukanisa ngamandla angaphandle ukuze kufezwe ukusika okungenamonakalo. Kuzoba yinto eyinhloko yokusika ama-wafer esikhathini esizayo.
(2) Ukubhoboza okuncane kwamabhodi wesekethe aguquguqukayo (i-FPC) kanye ne-PCB
Ama-smartphone namadivayisi agqokwayo adinga izingxenye ze-elekthronikhi ukuba zibe zincane futhi ububanzi bama-micropores kumabhodi e-PCB bufinyelele ezingeni le-micron. Ngobude bayo obufushane kanye namandla aphezulu e-photon, i-UV laser (UV Laser) ingafinyelela ukubhoboza ama-micropores ngempumelelo nangekhwalithi ephezulu enobubanzi obungu-50μm noma ngisho nobuncane.
Amadivayisi ezokwelapha kanye nokukhiqiza izinto eziphilayo: okwenziwe ngezifiso futhi okungafakelwa
Ukusetshenziswa kwe-laser emkhakheni wezokwelapha kuyanda kusukela ekuhlinzeni kwendabuko kuya Ukukhiqiza Ngokucophelela.
(1) Amadivayisi ezokwelapha afakelwa:
Isibonelo, ukusika ama-heart stents, ukushisela okuncane kwezimila ze-cochlear, ukuqoshwa okunembile kwezimbozo zemithi. Lezi zinsimu ezinezidingo eziphakeme kakhulu ezintweni zokwakha kanye nokunemba kokucubungula kumele zithembele ezicini zokucubungula ezibandayo zama-laser asheshayo ukuqinisekisa ukuthi ukuhambisana kwezinto eziphilayo akubhujiswa.
(2) Ukuphrinta kwe-3D kwezinto eziphilayo kanye nobunjiniyela bezicubu:
Ubuchwepheshe obufana nokudluliselwa phambili okubangelwa yi-laser (LIFT) buhlola ukusetshenziswa kwama-laser ukulawula ngokunembile ukufakwa kwama-bioink ukuze kufezwe ukunyatheliswa okunembile kwamangqamuzana aphilayo, izicubu nezitho zomzimba, okuhlinzeka ngethuba lokuhlolwa kwemithi yokuvuselela kanye nemithi.
→ Isakhiwo semakethe kanye nokuthuthuka kochungechunge lwezimboni: ukwenziwa kwendawo kanye nokuhlanganiswa
Umncintiswano wesikhathi esizayo embonini yokucubungula i-laser uzoshintsha usuka emncintiswaneni wehadiwe omsulwa uye emncintiswaneni ophelele wokuhlanganiswa kwesistimu, amaphakheji enqubo yohlelo lokusebenza kanye nezinsizakalo zasendaweni.
Ukuhlanganiswa okuqondile kochungechunge lwezimboni kanye nokusheshisa kokufakwa esikhundleni kwekhaya
(1) Ukubekwa kwezindawo kwezingxenye eziyinhloko eziphezulu
Esikhathini esidlule, ama-laser (ikakhulukazi ama-laser e-fiber asheshayo futhi anamandla amakhulu) ayethembele kakhulu ekungenisweni kwemithombo yawo yepompo eyinhloko, ama-grating, kanye nama-fiber akhethekile. Esikhathini esizayo, njengoba ukutshalwa kwezimali kwasekhaya ocwaningweni lwesayensi kwanda, ukufakwa esikhundleni kwezingxenye eziyinhloko ezingenhla kuzoshesha. Lokhu kuzonciphisa kakhulu izindleko zokukhiqiza imishini ye-laser futhi kuthuthukise ukuzinza kanye nesivinini sokuphendula kweketanga lokuhlinzeka.
Umkhuba: Abakhiqizi bemishini ye-laser abaningi bazobona ukuhlanganiswa okuqondile kwama-laser, ama-galvanometer kanye nezinhlelo zokulawula ukuze banikeze izixazululo eziphelele ezilungiselelwe kahle.
(2) Gqamisa inani lephakheji yenqubo yesicelo
Idivayisi ngokwayo iyisithwali nje. Kuzinhlelo zokusebenza ezintsha ezifana namandla amasha kanye nama-semiconductor, lokho abasebenzisi abakudingayo ngempela ulwazi lokucubungula "indlela yokusebenzisa ama-laser ukucubungula into ethile nokufeza imiphumela ethile."
Ukugxila komncintiswano wesikhathi esizayo ukuhlinzeka ngemininingwane yezinqubo nezixazululo eziqondene nomkhakha (i-Know-How), okudinga izinkampani ze-laser ukuthi zingene zijule emigqeni yokukhiqiza yabasebenzisi futhi zithuthukise ngokubambisana ukugeleza kwezinqubo okwenziwe ngokwezifiso.
Ukuhlanganiswa kwemingcele kanye nokwakhiwa kwemvelo
(1) Ukuhlanganiswa okujulile namarobhothi ezimboni kanye nemigqa yokukhiqiza ezenzakalelayo
Esikhathini esizayo, imishini ye-laser izoba khona ngesimo sezindawo zokusebenza eziguquguqukayo, ezixhunywe kalula namarobhothi ane-axis eningi, ama-trolley e-AGV kanye nezinhlelo zokulayisha nokulayisha ezizenzakalelayo, zibe yingxenye eyinhloko yefektri ehlakaniphile ezenzakalelayo ngokuphelele, engenamuntu (i-Dark Factory).
(2) Ukuhlola imodeli yesevisi ye-SaaS
Abanye abakhiqizi bemishini ye-laser bazohlola imodeli ethi "Imishini njengesevisi" (i-EaaS) noma "yokuqasha isikhathi sokucubungula" ukuze banciphise umkhawulo wokutshalwa kwezimali kokuqala kwabasebenzisi futhi bandise ukusebenza kahle kwemishini ngokuxilongwa okukude, ukulungiswa kokubikezela kanye nokuthuthukiswa kwesofthiwe.
Isiphetho: Hlangana nezinselele namathuba enkathi "yokukhiqiza okulula"
I imboni yokucubungula i-laser "kuseshumini leminyaka legolide" lokukhula okusheshayo. Intuthuko yayo yesikhathi esizayo izoba yinto entsha kathathu kwezobuchwepheshe, izinhlelo zokusebenza kanye namamodeli ebhizinisi.